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Waytec Electronics Corp.
Is Redefining "Excellence" in the Printed Circuit Board industry.
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"the ideal source for high quality lead free, prototype, military, itar and quick turn printed circuit boards"
Capabilities
| Standard | Emerging Technology | |
| Drilling Aspect Ratio - Drilled Hole Size | 12:1 | 20:1 |
| Min. Drilled Hole Size (vias) | .006 | .004 |
| Min. Outer Layer Via Land Size | .016 | .014 |
| Min. Inner Layer Via Land Size | .016 | .014 |
| Min. Via Relief on Power/Ground Planes | .015 | .015 |
| Min. Outer Layer Line Width | .003 | .003 |
| Min. Inner Layer Line Width | .003 | .0025 |
| Min. Outer Layer Line to Line Spacing | .004 | .004 |
| Min. Inner Layer Line to Line Spacing | .003 | .003 |
| Min. Component Pitch | .008 | .008 |
| Min. Brd Thickness | .010 | 008 |
| Max. Overall Board Thickness | .250" | .250" |
| Min. Dielectric Thickness | .002" | .002" |
| Min. Base Copper Weights | 1/4 oz | 1/4 oz |
| Impedance Tolerance | +/-7% | +/-5% |
| Impedance Range | 20-150 OHMS | 20-150 OHMS |
| Buried Resistance | N | N |
| Buried Via | Y | Y |
| Blind Via | Y | Y |
| Via in Pad | Y | Y |
| Mixed Materials | Y | Y |
Combination of : | Y | Y |
| Via Fill | Conductive Silver | Copper Plate |
| Surface Finishes | Lead Free HASL | Direct Imm Gold |
| Imm Silver | ||
| Imm Gold (ENIG) Flash Gold | ||
| RoHS Compliant | Y | Y |
| Lead Free Compatible | Y | Y |
| High Tg, Low Dk Materials | Y | Y |
| REV 02.15.2006.A |
| Web Master: Keith Birchfield |
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quickturnboards prototypeboards rohsboards silverboards
Highest Quality - Lowest Prices - Best Delivery - Printed Circuit Board Manufacturer